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Description
Double-sided fully automatic Device Name - Lithography Device status - Spot goods 賣家說推估是2005~2010之間 EVG在2010之前的設備，銘牌上都不會有年份 但這台是歐洲大廠拉出來的Configuration
Manual filter insertion Manual stage X,Y rotation topside objectives - 10X Manual Turrets Facility - 220V CDA : 6BAR N2 : 6BAR VAC : -0.8BAROEM Model Description
The EVG620 is a versatile tool developed by EV Group (EVG) that serves as both an optical double-side lithography and precision alignment system, specifically designed for wafers up to 100 mm in size. The system is capable of safely handling thick, bowed, or small diameter wafers, providing enhanced flexibility in wafer processing. The EVG620's alignment stage design is a standout feature, delivering highly accurate alignment and exposure results for precise patterning. It is equipped with high-resolution top and bottom side split-field microscopes, ensuring excellent imaging capabilities. The user-friendly interface, based on Windows, streamlines the operation of the EVG620, making it a reliable and efficient tool for various lithography and alignment applications in semiconductor and microelectronics manufacturing.Documents
Verified
CATEGORY
Mask/Bond Aligners
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Installed / Idle
Product ID:
80512
Wafer Sizes:
6"/150mm
Vintage:
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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EVGroup (EVG)
EVG620
CATEGORY
Mask/Bond Aligners
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Installed / Idle
Product ID:
80512
Wafer Sizes:
6"/150mm
Vintage:
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Double-sided fully automatic Device Name - Lithography Device status - Spot goods 賣家說推估是2005~2010之間 EVG在2010之前的設備，銘牌上都不會有年份 但這台是歐洲大廠拉出來的Configuration
Manual filter insertion Manual stage X,Y rotation topside objectives - 10X Manual Turrets Facility - 220V CDA : 6BAR N2 : 6BAR VAC : -0.8BAROEM Model Description
The EVG620 is a versatile tool developed by EV Group (EVG) that serves as both an optical double-side lithography and precision alignment system, specifically designed for wafers up to 100 mm in size. The system is capable of safely handling thick, bowed, or small diameter wafers, providing enhanced flexibility in wafer processing. The EVG620's alignment stage design is a standout feature, delivering highly accurate alignment and exposure results for precise patterning. It is equipped with high-resolution top and bottom side split-field microscopes, ensuring excellent imaging capabilities. The user-friendly interface, based on Windows, streamlines the operation of the EVG620, making it a reliable and efficient tool for various lithography and alignment applications in semiconductor and microelectronics manufacturing.Documents
Similar Listings
View AllEVGroup (EVG)
EVG620
Mask/Bond AlignersVintage: 2023Condition: UsedLast Verified:Over 60 days agoEVGroup (EVG)
EVG620
Mask/Bond AlignersVintage: 2023Condition: UsedLast Verified:Over 60 days agoPREFERRED