PG300RM
Category
Lapping, Polishing, GrindingOverview
Grinder + CMP stress release High through put wafer handling 15umt wafer thickness in mass producing. The RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames. Performs the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine. All the processes are completed without moving the wafer on the same chuck table.
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ACCRETECH / TSK
PG300RM
Lapping, Polishing, GrindingVintage: 2007Condition: UsedLast VerifiedOver 60 days agoACCRETECH / TSK
PG300RM
Lapping, Polishing, GrindingVintage: 2005Condition: UsedLast Verified2 days agoACCRETECH / TSK
PG300RM
Lapping, Polishing, GrindingVintage: Condition: UsedLast VerifiedOver 60 days agoACCRETECH / TSK
PG300RM
Lapping, Polishing, GrindingVintage: 2006Condition: UsedLast VerifiedOver 60 days ago