ACCRETECH next generation systems support optimum device productions.

Grinder + CMP stress release High through put wafer handling 15umt wafer thickness in mass producing. The RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames. Performs the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine. All the processes are completed without moving the wafer on the same chuck table.

ACCRETECH / TSK

PG300RM

HRG200X

PG3000RM

PG200

HRG300

HRG3000RMX

PG300

PG3000RMX2

PG200RM

The PG3000RMX is a Polish Grinder manufactured by ACCRETECH - TOKYO SEIMITSU. It is designed for simultaneous thinning and defect removal of wafers up to 300 mm. It performs the processes of rough grinding, fine grinding, polishing, and cleaning wafers on both sides in a single machine. All the processes are completed without moving the wafer on the same chuck table. It has a high throughput for 15 µm wafer thinning in high volume production.

PG3000RMX

HRG300A

ACCRETECH / TSK

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Top ACCRETECH / TSK Lapping, Polishing, Grinding

PG300RM

HRG200X

PG3000RM

HRG300A

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