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ACCRETECH / TOSEI W-GM-4250
    Description
    No description
    Configuration
    Recently offline and has been wrapped.
    OEM Model Description
    W-GM-4250 is a Wafer Edge Grinding Machine from the W-GM series by TOSEI ENGINEERING CORP. It has 2 grinding stages with a 4-cassette loader and is capable of grinding various materials such as Silicon, Sapphire and compound materials such as SiC. It is designed for easy operation by touch screen and graphical user interface. The W-GM-4250 is part of the W-GM-4200 Series and is designed for 2" to 8" wafer production.
    Documents

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    ACCRETECH / TOSEI

    W-GM-4250

    verified-listing-icon

    Verified

    CATEGORY
    Lapping, Polishing, Grinding

    Last Verified: Over 60 days ago

    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    63752

    Wafer Sizes:

    Unknown

    Vintage:

    Unknown

    Have Additional Questions?
    Logistics Support
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    Money Back Guarantee
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    Transaction Insured by Moov
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    Similar Listings
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    ACCRETECH / TOSEI W-GM-4250

    ACCRETECH / TOSEI

    W-GM-4250

    Lapping, Polishing, Grinding
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago
    ACCRETECH / TOSEI W-GM-4250

    ACCRETECH / TOSEI

    W-GM-4250

    Lapping, Polishing, Grinding
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago

    ACCRETECH / TOSEI

    W-GM-4250

    verified-listing-icon
    Verified
    CATEGORY
    Lapping, Polishing, Grinding
    Last Verified: Over 60 days ago
    listing-photo-e9d93bd855f3476a8bf7fa7d63b8b82f-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/49957/e9d93bd855f3476a8bf7fa7d63b8b82f/795fb842537a4e82b70ca7f4d6130479_180f3685ff1246baa747bb0e1d4b38b01201a_mw.jpeg
    listing-photo-e9d93bd855f3476a8bf7fa7d63b8b82f-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/49957/e9d93bd855f3476a8bf7fa7d63b8b82f/4633b66aa30a470b87590061bd165242_08612d2fcb0342fc917134cd3e7215eb_mw.jpeg
    listing-photo-e9d93bd855f3476a8bf7fa7d63b8b82f-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/49957/e9d93bd855f3476a8bf7fa7d63b8b82f/98c14e06fad74bc3b4d778bc606eec94_c0865011dc2c4ba994e7be3cdbce66731201a_mw.jpeg
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    63752

    Wafer Sizes:

    Unknown

    Vintage:

    Unknown

    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    Recently offline and has been wrapped.
    OEM Model Description
    W-GM-4250 is a Wafer Edge Grinding Machine from the W-GM series by TOSEI ENGINEERING CORP. It has 2 grinding stages with a 4-cassette loader and is capable of grinding various materials such as Silicon, Sapphire and compound materials such as SiC. It is designed for easy operation by touch screen and graphical user interface. The W-GM-4250 is part of the W-GM-4200 Series and is designed for 2" to 8" wafer production.
    Documents

    No documents

    Similar Listings
    View All
    ACCRETECH / TOSEI W-GM-4250

    ACCRETECH / TOSEI

    W-GM-4250

    Lapping, Polishing, GrindingVintage: 0Condition: UsedLast Verified: Over 60 days ago
    ACCRETECH / TOSEI W-GM-4250

    ACCRETECH / TOSEI

    W-GM-4250

    Lapping, Polishing, GrindingVintage: 0Condition: UsedLast Verified: Over 60 days ago