Description
High-Energy Ion ImplanterConfiguration
Ion Source Assembly Mass Analyzer Magnet RF Linear Accelerator (Multi-Stage RF Resonant Cavities) Wafer Processing Station Power Distribution Rack Vacuum Measurement Control Cabinets Wafer loading interface (EFEM/load port)OEM Model Description
High energy implanter. processing 300-mm wafers, the HE3 produces higher ion energies than the GSD/HE in a package that incorporates higher efficiency linear accelerator technology. The system layout has also been optimized so that footprint is reduced compared to the GSD/VHE while maintaining the same twin well and triple well process capability. A new endstation capable of batch processing 300-mm wafers, at a mechanical throughput equal to or exceeding that for 200-mm wafers in the GSD/HE system, has been developed.Documents
No documents
Verified
CATEGORY
Ion Implantation
Last Verified: 2 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
158121
Wafer Sizes:
Unknown
Vintage:
2015
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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AXCELIS
NV GSD HE3
CATEGORY
Ion Implantation
Last Verified: 2 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
158121
Wafer Sizes:
Unknown
Vintage:
2015
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
High-Energy Ion ImplanterConfiguration
Ion Source Assembly Mass Analyzer Magnet RF Linear Accelerator (Multi-Stage RF Resonant Cavities) Wafer Processing Station Power Distribution Rack Vacuum Measurement Control Cabinets Wafer loading interface (EFEM/load port)OEM Model Description
High energy implanter. processing 300-mm wafers, the HE3 produces higher ion energies than the GSD/HE in a package that incorporates higher efficiency linear accelerator technology. The system layout has also been optimized so that footprint is reduced compared to the GSD/VHE while maintaining the same twin well and triple well process capability. A new endstation capable of batch processing 300-mm wafers, at a mechanical throughput equal to or exceeding that for 200-mm wafers in the GSD/HE system, has been developed.Documents
No documents