Overview

"The ASML PAS 5500/60 stepper is an i-line system with automatic 100mm wafer cassette processing capability. Using 365nm near-UV light this stepper is capable of a minimum feature size of 450nm and alignment between lithographic layers of 90nm. The stepper uses 5X reduction imaging allowing a maximum die area of 18mm by 22.4mm per exposure. The “60” is the first system of the PAS 200mm wafer-capable 5500 family of steppers and scanners. The PAS 5500/60 is a sub-half-micron i-line stepper delivering throughputs up to 48 200-mm wafers per hour while meeting design rules down to 0.45 micron.The “60” is the first system of the PAS 200mm wafer-capable 5500 family of steppers and scanners. The PAS 5500 platform marks a great step forward from the PAS 2500/5000 in terms of imaging and throughput capabilities The PAS 5500/60 is a sub-half-micron i-line stepper delivering throughputs up to 48 200-mm wafers per hour while meeting design rules down to 0.45 micron.