ASML provides chipmakers with everything they need – hardware, software and services – to mass produce patterns on silicon through lithography.

The ASML PAS 2500/40 is an I-Line (365nm) stepper with a working resolution of 0.7 micron. It is used for IC production on 3, 4, 5 and 6 inch wafers. The PAS 2500/40 stepper uses a 0.40 NA i-line lens with a 21.1mm image field diameter and is optimized for sub 0.7micron production resolutions using i-line processes.

ASML

PAS 2500/40

The PAS 5500/400 is specified at 0.30um Current i-Line resists are capable to resolve structures down to 0.30 and 0.28um imaging. The maximum MA of the PAS 5500/400 is 0.65. Together with the AERIAL Illuminator the /400 will provide enough process latitude for mass production at 0.30um, extendable down to 0.28 and 0.25um. The highest resolution of the /400 maximized the number of i-Line layers in a full device layer stack.

PAS 5500/400

TWINSCAN XT:400F

Designed for mass production at 0.4 µm and achieves extremely high throughout while maintaining versatility with its variable Numerical
Aperture (NA). This stepper extends i-line’s capability for manufacturing multiple generations of subhalf-micron design rules by optimizing both depth of focus and resolution for critical process layers.
NA:0.60

PAS 5500/100D

TWINSCAN AT:400S

The TWINSCAN XT:400G 365-nm Step-and-Scan system is an ultra high-productivity, dual-stage lithography tool designed for volume 300-mm wafer production at 350-nm resolution. The dual wafer-stage technology of the TWINSCAN platform enables the exposure of one wafer and the alignment and mapping of the next wafer to take place in parallel, thereby virtually eliminating overhead time and allowing for continuous patterning of wafers.

TWINSCAN XT:400G

"The ASML PAS 5500/60 stepper is an i-line system with automatic 100mm wafer cassette processing capability. Using 365nm near-UV light this stepper is capable of a minimum feature size of 450nm and alignment between lithographic layers of 90nm. The stepper uses 5X reduction imaging allowing a maximum die area of 18mm by 22.4mm per exposure.
The “60” is the first system of the PAS 200mm wafer-capable 5500 family of steppers and scanners.
The PAS 5500/60 is a sub-half-micron i-line stepper delivering throughputs up to 48 200-mm wafers per hour while meeting design rules down to 0.45 micron.The “60” is the first system of the PAS 200mm wafer-capable 5500 family of steppers and scanners. The PAS 5500 platform marks a great step forward from the PAS 2500/5000 in terms of imaging and throughput capabilities
The PAS 5500/60 is a sub-half-micron i-line stepper delivering throughputs up to 48 200-mm wafers per hour while meeting design rules down to 0.45 micron.

PAS 5500/60

AT:400 is an i-line system, thereby ensuring the lowest cost per level even with advanced process technologies. The TWINSCAN platform allows either left- or right-hand configuration for optimum fab layout with track processing equipment and 300 mm automated materials handling systems.

TWINSCAN AT:400

The PAS 5500/250C is an i-line stepper specified at a resolution of 0.30 µm. Focal plane deviation, astigmatism, and distortion have all been improved without compromising overlay performance, which is now specified at < 45 nm.

Leadership productivity is maintained at more than 93 wph (ATP settings). The PAS 5500/250C uses an AERIAL™ illuminator, which provides flexible and automated NA/Sigma combinations in both conventional and off-axis illumination modes while maintaining high intensities to enable economical mass production of leading-edge devices.

PAS 5500/250C

The PAS 5000/55A steppers use a 0.48 NA i-Line lens with a.21.2 mm image field diameter. These steppers are optimized for 0.50 μm production resolutions and are ideal for all types of IC production, from telecommunications to ASICs, and on various substrates, from Silicon to GaAs.

PAS 5000/55A

PAS 5500/100C (predecessor PAS 5500/100 model) is specified for throughput of 61 200-millimeter (8-inch) wafers per hour. The ASML PAS 5500 / 100C is Steppers and Scanners system. the PAS 5500 / 100C can be used with a 6”-8” wafer size.

PAS 5500/100C

PAS 5000/45C

TWINSCAN AT:400G

The PAS 5500/200 was the first stepper to incorporate ASML’s revolutionary AERIAL™ Illuminator, a versatile component that provides both the flexibility to switch between conventional and off-axis illumination modes and the high intensity to enable economical IC mass production.
The i-Line Stepper combines 0.35 micron resolution with outstanding overlay performance. The 5500/200 is among ASML’s most successful types built, and has later been succeeded by an improved version, the PAS 5500/250.

PAS 5500/200

TWINSCAN XT:400

The PAS 5000/55A steppers feature a 0.48NA i-Line lens with a 21.2mm field, optimized for 0.5µm resolutions across IC productions and substrates like Silicon to GaAs. It boasts superior overlay performance due to its fast linear-electric exposure stage and phase grating alignment system. User-friendly software streamlines metrology tests in multi-stepper setups, promoting design rule optimization and enhanced yield. With only two alignment marks required, alignment time is minimized. Its swift stage and lack of need for send-ahead wafers guarantee peak productivity and precision. Additionally, it integrates a SMIF-compatible, high-speed reticle management system.

PAS 5000/55

PAS 5000/55C

The ASML PAS 5500/250 is a lithography system that is used in the production of semiconductors. It is a high-end system that is capable of producing high-quality images with a high degree of accuracy. The system uses a variety of advanced technologies to achieve this level of performance, including advanced optics, precision motion control systems, and sophisticated software algorithms. The PAS 5500/250 is designed to be highly flexible and can be used for a wide range of applications, including the production of microprocessors, memory chips, and other semiconductor devices. It is also designed to be highly reliable and easy to use, with a user-friendly interface and intuitive controls that make it easy to operate.

PAS 5500/250

PAS 5000/55B

Has a throughput of more than 110 wafers per hour for 150-mm (six-inch) substrates and more than 80 wafers per hour for 200-mm (8-inch) substrates.

PAS 5500/150

The PAS 5500/200B is the first stepper to incorporate ASML's revolutionary AERIALTM illuminator, a versatile component that provides both the flexibility to switch between conventional and off-axis illumination modes and the high intensity to enable economical mass production of next-generation devices. The i-line stepper combines 0.35 micron resolution with industry-leading overlay performance of 50nm, or 100nm in machine-to-machine matching.

PAS 5500 / 200B

500nm resolution and <70nm alignment accuracy. Set up for 4” wafers but convertible to 3” or 6” platforms. 21mm x 21mm field size. 1.3µm depth of focus. The PAS 5500/80B was introduced as a wide-field production stepper belonging to the then most advanced and productive stepper family in the world.
Its half micron imaging, precise pattern overlay, industry leading throughput and overall versatility of the PAS 5500/80B made it an ideal production stepper for manufacturing multiple generations of DRAMs, ASICs, and Microprocessors. The PAS 5500/80 is still in use in fabs around the world as a volume production tool for non-critical layers.

PAS 5500/80

PAS 5200/45A

The PAS 5500/275D is an i-line stepper stretching resolution down to 0.28 μm and beyond. It is built on the success of the proven PAS 5500/250C advanced i-line stepper. The PAS 5500/275D features improved imaging achieved by applying the latest techniques in lens adjustment as well as improved overlay by including phase modulation in the system. In addition to that, Image Quality Control is included as standard. Leadership productivity is improved to more than 100 wph (ATP settings). The PAS 5500/275D uses an AERIAL illuminator, which provides flexible and automated NA/sigma combinations in both conventional and off-axis illumination modes while maintaining high intensities to enable economical mass production of leading-edge devices.

PAS 5500/275D

PAS 5000/45B

The PAS 5500/80B was introduced as a wide-field production stepper belonging to the then most advanced and productive stepper family in the world.
Its half micron imaging, precise pattern overlay, industry leading throughput and overall versatility of the PAS 5500/80B made it an ideal production stepper for manufacturing multiple generations of DRAMs, ASICs, and Microprocessors. The PAS 5500/80 is still in use in fabs around the world as a volume production tool for non-critical layers.
The PAS 5500/80B was introduced as a wide-field production stepper belonging to the then most advanced and productive stepper family in the world.
Its half micron imaging, precise pattern overlay, industry leading throughput and overall versatility of the PAS 5500/80B made it an ideal production stepper for manufacturing multiple generations of DRAMs, ASICs, and Microprocessors. The PAS 5500/80 is still in use in fabs around the world as a volume production tool for non-critical layers.

PAS 5500/80B

PAS 5500/22

TWINSTAR AT:400M

PAS 5500/400B

The XT:400L is a dual-stage lithography system designed for volume production of 200 mm and 300 mm wafers down to a 220 nm resolution.
High throughput and yield are combined with fast reticle exchange times and lot streaming to provide the lowest cost of operation

TWINSCAN XT:400L

PAS 5500/125E

The PAS 5500/400C i-Line Step & Scan system has a variable NA (0.48 to 0.65) 4x projection lens, which combined with ASML’s AERIAL™ Illuminator provides 280nm resolution. ASML’s revolutionary Step & Scan stage technology enables users to take full advantage of the AERIAL™ Illumination intensity and advanced i-Line resists for throughputs of greater than 114 200mm wph. Long-term production overlay is less than 35nm. The PAS 5500/400C Step & Scan system’s resolution and productivity ensures the lowest operating cost for advanced i-Line lithography.

PAS 5500/400C

PAS 5500/275

The TWINSCAN AT:400T is an an ArF system.

TWINSCAN AT:400T

TWINSCAN XT:400M

TWINSCAN AT:400L

The ASML PAS 5500 is a lithography platform that shaped ASML’s market success and technology leadership. It became ASML’s longest-lived lithography platform and one of its most versatile product lines1. The PAS 5500 is a versatile machine that can be adapted for many new markets and special applications. ASML PAS 5500 / 200A is Steppers and Scanners system. PAS 5500 / 200A can be used with an 8” wafer size.

PAS 5500 / 200A

TWINSCAN AT:400E

The PAS 2500/40 stepper uses a 0.40NA i-line lens with a 21.1mm image field diameter. This stepper is optimized for sub 0.7micron production resolutions using i-line processes.

PAS 5000/40

TWINSCAN XT:450

The XT:450E’s high-intensity illuminator offers both conventional and annular illumination modes, enabling feature sizes down to 0.22 µm (with optional upgrades). The XT:450E also offers improved accuracy to go with its improved resolution – with 15 nm single-machine overlay.

TWINSCAN XT:450E

The productivity enhancements in TWINSCAN C increase wafer output to over 110 wafers per hour for 300 mm wafers at real production conditions (109 exposures per wafer). The TWINSCAN C product family will be available on four systems: the AT:400C, AT:750C, AT:850C and AT:1150C.

TWINSCAN AT:400C

The PAS 5500/450F is the latest and most advanced addition to the i-line Step-and-Scan family. This mass production tool is the successor of the PAS 5500/400 for non-critical applications. This tool is extendable to critical i-line down to 220 nm. The PAS 5500/450F combines the imaging power of a variable 0.48-0.65-NA Carl Zeiss Starlith 4X reduction lens with a high speed scanning stage to deliver a high productivity tool with a superior value of ownership for maximum yield.

The modular PAS 5500 platform typically ensures future extendibility for productivity, imaging and overlay. The system is fully configurable to meet production requirements and offers both ease-of-manufacturing and cost-effectiveness in a high-volume production environment.

The PAS 5500/450F continues to raise the bar for imaging performance and productivity in the 200-mm litho market.

PAS 5500/450

The PAS 5500/450F is the latest and most advanced addition to the i-line Step-and-Scan family. This mass production tool is the successor of the PAS 5500/400 for non-critical applications. This tool has been extended to critical i-line down to 220 nm. The PAS 5500/450F combines the imaging power of a variable 0.48-0.65-NA Carl Zeiss Starlith 4X reduction lens with a high speed scanning stage to deliver a high productivity tool with a superior value of ownership for maximum yield. The system is fully configurable to meet production requirements and offers both ease-of-manufacturing and costeffectiveness in a high-volume production environment. The PAS 5500/450F continues to raise the bar for imaging performance and productivity in the 200-mm litho market.

PAS 5500/450F

The PAS 5500/400D is a stepper and scanner equipped with a 4x projection lens, enhanced by ASML's AERIAL Illuminator to deliver a 280-nm resolution. Its Step-and-Scan stage technology, paired with advanced i-line resists, offers throughputs of 124 200-mm wph, ensuring cost-efficient operation for advanced i-line lithography. Furthermore, it achieves a mask overlay of 35 nanometers and amplifies surface energy density by tenfold.

PAS 5500/400D

PAS 5500/100B

The XT:400E is an ultra-high-throughput, mainstream i-line scanner for 300-mm wafers. Delivering feature sizes down to 350 nm, it is specifically aimed at fabrication of non-critical layers and, with this in mind, has been designed to lower the overall Cost-ofOwnership (CoO). 

TWINSCAN XT:400E

The PAS 5000/50 stepper by ASM Lithography has a 0.48 NA i-line lens with a 15x15 mm field and 0.5 um resolution. It boasts an enhanced overlay performance exceeding 125 nm with 99.7% accuracy. Using a dual through-the-lens alignment system, it negates the need for baseline references and send-ahead wafers. The system is unaffected by alignment mark variations, commonly seen on layers like grainy aluminum. Optimized illumination ensures high throughput and CD control for 0.5 um production. With a notable "etendu", it provides intense wafer plane illumination. Its precision is evident with a three-sigma CD repeatability of 0.03 um for 0.5 um features.

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PAS 5500/100D

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PAS 2500/40

TWINSCAN XT:400F

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