
Description
No descriptionConfiguration
-150 mm Production with Max production 100 Pcs -2 IO Port ,16 Carrier Stock -System CTL TS-4000Z Series , Temp CTL M120 -Heater Type : 5 Zone / PID CTL / 600 – 1000 Deg+-1Deg -Fork Transfer with 5 -Power : AC200 V 40 KVA ,AC100V ,3KVA -MFC Type : Area Series -Gas :N2,O2 ,H2,HCl, -AP Pyro Oxide -Heater Type : VMU Series -Max. Production wafer : 100 PcsOEM Model Description
Alpha-8 is a first-generation Alpha furnace designed for processing 200mm wafers in a vertical orientation. This furnace is capable of handling a wide range of semiconductor processing applications, including oxidation, diffusion, and annealing. Its vertical design allows for efficient use of space and improved temperature uniformity across the wafer.Documents
No documents
Verified
CATEGORY
Furnaces / Diffusion
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
65737
Wafer Sizes:
Unknown
Vintage:
1998
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
View AllTEL / TOKYO ELECTRON
ALPHA 8
CATEGORY
Furnaces / Diffusion
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
65737
Wafer Sizes:
Unknown
Vintage:
1998
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
-150 mm Production with Max production 100 Pcs -2 IO Port ,16 Carrier Stock -System CTL TS-4000Z Series , Temp CTL M120 -Heater Type : 5 Zone / PID CTL / 600 – 1000 Deg+-1Deg -Fork Transfer with 5 -Power : AC200 V 40 KVA ,AC100V ,3KVA -MFC Type : Area Series -Gas :N2,O2 ,H2,HCl, -AP Pyro Oxide -Heater Type : VMU Series -Max. Production wafer : 100 PcsOEM Model Description
Alpha-8 is a first-generation Alpha furnace designed for processing 200mm wafers in a vertical orientation. This furnace is capable of handling a wide range of semiconductor processing applications, including oxidation, diffusion, and annealing. Its vertical design allows for efficient use of space and improved temperature uniformity across the wafer.Documents
No documents