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-150 mm Production with Max production 100 Pcs -2 IO Port ,16 Carrier Stock -System CTL TS-4000Z Series , Temp CTL M120 -Heater Type : 5 Zone / PID CTL / 600 – 1000 Deg+-1Deg -Fork Transfer with 5 -Power : AC200 V 33 KVA ,AC100V ,3KVA -MFC Type : Area Series -Gas :N2, 4%H2/He -AP Sinter Anneal -Heater Type : VMM Series -Max. Production wafer : 100 PcsOEM Model Description
Alpha-8 is a first-generation Alpha furnace designed for processing 200mm wafers in a vertical orientation. This furnace is capable of handling a wide range of semiconductor processing applications, including oxidation, diffusion, and annealing. Its vertical design allows for efficient use of space and improved temperature uniformity across the wafer.Documents
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TEL / TOKYO ELECTRON
ALPHA 8
Verified
CATEGORY
Furnaces / Diffusion
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
65738
Wafer Sizes:
Unknown
Vintage:
Unknown
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Logistics Support
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Money Back Guarantee
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Transaction Insured by Moov
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Refurbishment Services
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TEL / TOKYO ELECTRON
ALPHA 8
CATEGORY
Furnaces / Diffusion
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
65738
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
-150 mm Production with Max production 100 Pcs -2 IO Port ,16 Carrier Stock -System CTL TS-4000Z Series , Temp CTL M120 -Heater Type : 5 Zone / PID CTL / 600 – 1000 Deg+-1Deg -Fork Transfer with 5 -Power : AC200 V 33 KVA ,AC100V ,3KVA -MFC Type : Area Series -Gas :N2, 4%H2/He -AP Sinter Anneal -Heater Type : VMM Series -Max. Production wafer : 100 PcsOEM Model Description
Alpha-8 is a first-generation Alpha furnace designed for processing 200mm wafers in a vertical orientation. This furnace is capable of handling a wide range of semiconductor processing applications, including oxidation, diffusion, and annealing. Its vertical design allows for efficient use of space and improved temperature uniformity across the wafer.Documents
No documents