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Description
ASM A400 with one standard Power Poly reactor and one Dope Power Poly reactor.Configuration
ASMi A400 LPCVD Dope PP & LPCVD std PP reactor Heater type: 5 zones Gas panel layout: SiH4 - N2 - Dopand Brooks MFC's Process pressure: 80 ÷ 120 mTorr Process temperature: 620 - 680 °C Genmark MK4 Robot Paddle temprature control PowerPoly specific flanges temp controlled at 80 °C Gas/smoke detection of SiH4OEM Model Description
The ASM AD400 is a diffusion and oxidation furnaces system used in semiconductor manufacturing. It is designed for processing 8-inch wafers with dual tubes or 6-inch wafers with dual boats. The system's body is anodized to resist corrosion, ensuring durability and reliability during wafer processing.Documents
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Key Item Details
Condition:
Refurbished
Operational Status:
Unknown
Product ID:
65295
Wafer Sizes:
Unknown
Vintage:
1998
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
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ASM
A400
CATEGORY
Furnaces / Diffusion
Last Verified: Over 60 days ago
Key Item Details
Condition:
Refurbished
Operational Status:
Unknown
Product ID:
65295
Wafer Sizes:
Unknown
Vintage:
1998
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
ASM A400 with one standard Power Poly reactor and one Dope Power Poly reactor.Configuration
ASMi A400 LPCVD Dope PP & LPCVD std PP reactor Heater type: 5 zones Gas panel layout: SiH4 - N2 - Dopand Brooks MFC's Process pressure: 80 ÷ 120 mTorr Process temperature: 620 - 680 °C Genmark MK4 Robot Paddle temprature control PowerPoly specific flanges temp controlled at 80 °C Gas/smoke detection of SiH4OEM Model Description
The ASM AD400 is a diffusion and oxidation furnaces system used in semiconductor manufacturing. It is designed for processing 8-inch wafers with dual tubes or 6-inch wafers with dual boats. The system's body is anodized to resist corrosion, ensuring durability and reliability during wafer processing.Documents
No documents