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22VOEM Model Description
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SHINKAWA
COF 300
CATEGORY
Flip Chip Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
80507
Wafer Sizes:
8"/200mm
Vintage:
2006
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
22VOEM Model Description
Flip Chip BonderDocuments
No documents