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Description
No descriptionConfiguration
22VOEM Model Description
Flip Chip BonderDocuments
No documents
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
80507
Wafer Sizes:
8"/200mm
Vintage:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
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SHINKAWA
COF 300
CATEGORY
Flip Chip Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
80507
Wafer Sizes:
8"/200mm
Vintage:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
22VOEM Model Description
Flip Chip BonderDocuments
No documents
Similar Listings
View AllPREFERRED
SHINKAWA
COF 300
Flip Chip BondersVintage: 2005Condition: UsedLast Verified:Over 60 days agoPREFERRED
SHINKAWA
COF 300
Flip Chip BondersVintage: 2007Condition: UsedLast Verified:Over 60 days agoPREFERRED