Description
FLIP CHIP BONDERConfiguration
No ConfigurationOEM Model Description
Flip Chip BonderDocuments
No documents
SHINKAWA
COF 300
Verified
CATEGORY
Flip Chip Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
112850
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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SHINKAWA
COF 300
CATEGORY
Flip Chip Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
112850
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
FLIP CHIP BONDERConfiguration
No ConfigurationOEM Model Description
Flip Chip BonderDocuments
No documents