Description
Flip Chip BonderConfiguration
No ConfigurationOEM Model Description
Based on the industrial benchmark Datacon QUANTUM series, production speed was significantly increased compared to the successful Datacon FC QUANTUM advanced to offer an unprecedented Cost of Ownership. At the same time, no compromise on 4μm accuracy and process control was made to enable tool-to-tool repeatability at highest yield. - Versatile High Speed Flip Chip Bonder - Unique Quattro Concept - Accuracy ± 4μm @ 3σ - UPH up to 16,000Documents
No documents
Verified
CATEGORY
Flip Chip Bonders
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
135122
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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BESI / DATACON
8800 FC QUANTUM hs
CATEGORY
Flip Chip Bonders
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
135122
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Flip Chip BonderConfiguration
No ConfigurationOEM Model Description
Based on the industrial benchmark Datacon QUANTUM series, production speed was significantly increased compared to the successful Datacon FC QUANTUM advanced to offer an unprecedented Cost of Ownership. At the same time, no compromise on 4μm accuracy and process control was made to enable tool-to-tool repeatability at highest yield. - Versatile High Speed Flip Chip Bonder - Unique Quattro Concept - Accuracy ± 4μm @ 3σ - UPH up to 16,000Documents
No documents