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8800 FC QUANTUM hs
Category
Flip Chip BondersOverview
Based on the industrial benchmark Datacon QUANTUM series, production speed was significantly increased compared to the successful Datacon FC QUANTUM advanced to offer an unprecedented Cost of Ownership. At the same time, no compromise on 4μm accuracy and process control was made to enable tool-to-tool repeatability at highest yield. - Versatile High Speed Flip Chip Bonder - Unique Quattro Concept - Accuracy ± 4μm @ 3σ - UPH up to 16,000
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