Skip to main content
6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
Moov logo

6" Fab For Sale from Moov - Click Here to Learn More
Moov Icon
BESI / ESEC 2100 FC
    Description
    Smema; Duples slide fluxer; Ionizer pick: BQC; WMP: Host; Substrate Handler SDH-84fc; SP84 speed; PXRAY;
    Configuration
    No Configuration
    OEM Model Description
    Die Bonder
    Documents

    No documents

    BESI / ESEC

    2100 FC

    verified-listing-icon

    Verified

    CATEGORY
    Flip Chip Bonders

    Last Verified: Over 60 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    76550


    Wafer Sizes:

    Unknown


    Vintage:

    2013


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    BESI / ESEC 2100 FC

    BESI / ESEC

    2100 FC

    Flip Chip Bonders
    Vintage: 2017Condition: Used
    Last VerifiedOver 60 days ago

    BESI / ESEC

    2100 FC

    verified-listing-icon
    Verified
    CATEGORY
    Flip Chip Bonders
    Last Verified: Over 60 days ago
    listing-photo-d69a01be13af45af9aa92dd42bbd5be7-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1948/d69a01be13af45af9aa92dd42bbd5be7/2a1d3001f0714225a438d5fb7d620a91_3632ae4644a6440c94a99b43a79c21891201a_mw.jpeg
    listing-photo-d69a01be13af45af9aa92dd42bbd5be7-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1948/d69a01be13af45af9aa92dd42bbd5be7/0e7d51d586f844bebe47d55dd7f1eb47_c75e816dd8334ca18e72bbccbb2114691201a_mw.jpeg
    listing-photo-d69a01be13af45af9aa92dd42bbd5be7-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1948/d69a01be13af45af9aa92dd42bbd5be7/a108dfd561d843b79519a33712f8531a_6b8c3cc63fc346adafdeadddec1f103c1201a_mw.jpeg
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    76550


    Wafer Sizes:

    Unknown


    Vintage:

    2013


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Smema; Duples slide fluxer; Ionizer pick: BQC; WMP: Host; Substrate Handler SDH-84fc; SP84 speed; PXRAY;
    Configuration
    No Configuration
    OEM Model Description
    Die Bonder
    Documents

    No documents

    Similar Listings
    View All
    BESI / ESEC 2100 FC

    BESI / ESEC

    2100 FC

    Flip Chip BondersVintage: 2017Condition: UsedLast Verified:Over 60 days ago
    BESI / ESEC 2100 FC

    BESI / ESEC

    2100 FC

    Flip Chip BondersVintage: 0Condition: UsedLast Verified:Over 60 days ago
    BESI / ESEC 2100 FC

    BESI / ESEC

    2100 FC

    Flip Chip BondersVintage: 2013Condition: UsedLast Verified:Over 60 days ago