BE Semiconductor Industries N.V. designs, develops, manufactures, markets and services die sorting, flip chip and multi-chip die bonding, packaging and plating equipment for the semiconductor industry's assembly operations.
Founded in 1968, Esec is a leading global manufacturer of die bonding equipment for the semiconductor, telecommunications and smart card industries based in Cham, Switzerland. It also manufactures and services wire bonding systems from its Singapore assembly facility.

BESI / ESEC

2100 FC

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Smema; Duples slide fluxer; Ionizer pick: BQC; WMP: Host; Substrate Handler SDH-84fc; SP84 speed; PXRAY;

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2100 FC

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BESI / ESEC

2100 FC

BESI / ESEC

2100 FC

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