Description
HandlerConfiguration
Hardware Type: Handler Status: GOOD Receive Date: 5/13/2013 Remark: Shut Down Mark Orientation: Yes Bottom Pad Vision: No In-Pocket Vision: No Count Varience: Yes Left Over Unit sensor at test site: NO Handler Output Bowl T/R / Bowl to Tube: BowlT/R PKG: 3x2-0.75 Change Kit: Only 3x2-0.75 Hnadler Parellism Single site / Dual site: Dual siteOEM Model Description
XD248 Precision Component Handling System – designed for versatility and efficiency in semiconductor manufacturing. With a throughput of 36,000 UPH, it handles QFN/MLP, SOIC, SOT23, SC70, SOT89, and SOT223 packages (1.0x0.6mm to 12x12mm). Featuring up to 8 test sites and optional advanced vision systems for rigorous testing and seamless transitions to Tape and Reel output. Elevate your production line with XD248's precision and efficiency.Documents
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SRM
XD 248
CATEGORY
Final Test
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
117219
Wafer Sizes:
Unknown
Vintage:
2013
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
HandlerConfiguration
Hardware Type: Handler Status: GOOD Receive Date: 5/13/2013 Remark: Shut Down Mark Orientation: Yes Bottom Pad Vision: No In-Pocket Vision: No Count Varience: Yes Left Over Unit sensor at test site: NO Handler Output Bowl T/R / Bowl to Tube: BowlT/R PKG: 3x2-0.75 Change Kit: Only 3x2-0.75 Hnadler Parellism Single site / Dual site: Dual siteOEM Model Description
XD248 Precision Component Handling System – designed for versatility and efficiency in semiconductor manufacturing. With a throughput of 36,000 UPH, it handles QFN/MLP, SOIC, SOT23, SC70, SOT89, and SOT223 packages (1.0x0.6mm to 12x12mm). Featuring up to 8 test sites and optional advanced vision systems for rigorous testing and seamless transitions to Tape and Reel output. Elevate your production line with XD248's precision and efficiency.Documents
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