S 248, accommodating a variety of packages including QFN, SOT23, SOT89, SOT223, SC70, Soic8, and more. With an expansive QFN/MLP Package type range from 1X1 to 12x12, this advanced machine features a bowl-feed input, tape and reel 8 or 12, 16mm output system, and the option for a second tape/reel or stacked tubes output. Boasting 24 pick-up heads within its turret system, it achieves a remarkable Up to 14 K UPH with an indexing time of just 130ms. Offering exceptional testing capabilities with 4x single and Kelvin contact, serial, and parallel test sites, complemented by a sophisticated vision system featuring 2D Mark, 3D Co-plan, and in-pocket inspection options. This compact powerhouse, measuring 1500 x 1100 x 1800 mm (L x W x H), operates seamlessly with power supply options of 3-phase 208 VAC or 415 VAC and minimum 5 bar air supply

S 248

STV 202

S328

XD244 Tube Input Precision Component Handling System - a game-changing solution for semiconductor manufacturing. Designed to handle a versatile range of packages, including TSSOP 14-38, SOIC, MSOP, D-PAK, TO220, and QFN/MLP, this high-performance model achieves an impressive 28K UPH. Operating with a stackable tube loader for input and a tape and reel output, it offers 4 test sites and the option for advanced vision systems, including Mark & Orientation or PVI, 3D Lead or Bottom Pad or 5S, and 2D In-Pocket Mark/Orientation. 

XD 244

XD 208

Z208

STV 242

XD 206

XD248 Precision Component Handling System – designed for versatility and efficiency in semiconductor manufacturing. With a throughput of 36,000 UPH, it handles QFN/MLP, SOIC, SOT23, SC70, SOT89, and SOT223 packages (1.0x0.6mm to 12x12mm). Featuring up to 8 test sites and optional advanced vision systems for rigorous testing and seamless transitions to Tape and Reel output. Elevate your production line with XD248's precision and efficiency.

XD 248

Z206

D 246

XD 246

Z248 Bowl Input Precision Component Handling System – a cutting-edge solution that seamlessly accommodates an extensive array of package sizes, from the minuscule 1.0x0.6mm to the substantial 12x12mm, encompassing QFN/MLP, SOIC, SOT23, SC70, SOT89, and SOT223 formats. With a relentless throughput of 48,000 units per hour (UPH), a maximum of 8 test sites, and optional visionary enhancements including 2D and 3D inspection systems, the Z248 sets an unparalleled standard in semiconductor manufacturing efficiency and accuracy, ensuring each component's flawless journey from Bowl Feed input to Tape and Reel output. Tailor your production process even further with additional options like SEC GEMS and RS232, and embrace the future of high-performance component handling.

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