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Description
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Two of the cooling systems and two of the oven units that has 2 ovens each.OEM Model Description
B6700D uses a high-capacity power supply that delivers a maximum of 256 amps per burn-in board - twice that of the first-generation B6700 tester. In addition, it has twice the driver pin resources as its predecessor, enabling it to reach higher testing frequencies and efficiency. It can also maintain or increase parallelism to keep throughput high as the number of stacked NAND die per package increases in the future. Additionally, the B6700D's oven can replicate operating conditions while controlling temperature in 0.1 ℃ increments.Documents
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Key Item Details
Condition:
New
Operational Status:
Unknown
Product ID:
96442
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ADVANTEST
B6700D
CATEGORY
Final Test
Last Verified: Over 60 days ago
Key Item Details
Condition:
New
Operational Status:
Unknown
Product ID:
96442
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Two of the cooling systems and two of the oven units that has 2 ovens each.OEM Model Description
B6700D uses a high-capacity power supply that delivers a maximum of 256 amps per burn-in board - twice that of the first-generation B6700 tester. In addition, it has twice the driver pin resources as its predecessor, enabling it to reach higher testing frequencies and efficiency. It can also maintain or increase parallelism to keep throughput high as the number of stacked NAND die per package increases in the future. Additionally, the B6700D's oven can replicate operating conditions while controlling temperature in 0.1 ℃ increments.Documents
No documents