Description
Memory TesterConfiguration
Memory TesterOEM Model Description
The ADVANTEST T5377 is a multi-functional test system designed for memory semiconductors, aimed at reducing testing costs for semiconductor manufacturers. It serves both front-end testing of DRAM semiconductors and back-end testing of flash memory semiconductors. With the capability to test up to 256 devices simultaneously, the T5377 significantly improves testing efficiency. The T5377 offers double the throughput capabilities of its predecessor, the T5371, resulting in higher production rates and decreased testing costs for customers. It optimizes its memory repair analytical structure to align with a user's memory repair algorithm, making it well-suited for semiconductor manufacturing facilities that utilize 300-millimeter wafers.Documents
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ADVANTEST
T5377
Verified
CATEGORY
Final Test
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
90935
Wafer Sizes:
Unknown
Vintage:
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ADVANTEST
T5377
CATEGORY
Final Test
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
90935
Wafer Sizes:
Unknown
Vintage:
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Memory TesterConfiguration
Memory TesterOEM Model Description
The ADVANTEST T5377 is a multi-functional test system designed for memory semiconductors, aimed at reducing testing costs for semiconductor manufacturers. It serves both front-end testing of DRAM semiconductors and back-end testing of flash memory semiconductors. With the capability to test up to 256 devices simultaneously, the T5377 significantly improves testing efficiency. The T5377 offers double the throughput capabilities of its predecessor, the T5371, resulting in higher production rates and decreased testing costs for customers. It optimizes its memory repair analytical structure to align with a user's memory repair algorithm, making it well-suited for semiconductor manufacturing facilities that utilize 300-millimeter wafers.Documents
No documents