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SP102

Category
Wet Etch
Overview

The SEZ 102 is a Spin-Processor for single wafer processing. It supports 3, 4, 5, and 6-inch wafers on 150mm and has multiple vertically integrated process chambers. The system is fully automatic and can recycle, heat, and filter chemical solutions. It supports a wide range of applications including photolithography yield enhancement, back surface metal clean, back surface film removal, bevel/edge film removal, silicon etch, stress relief, post-etch polymer removal, oxide etching, post CMP clean, film structuring (BEOL), wafer manufacturing enhancement, and GaAs processing.

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