Description
Tackiness TesterConfiguration
No ConfigurationOEM Model Description
The Malcom TK-1 Tackiness Tester is widely used to help predict solder paste tack time, limiting the potential for dropped components, using either the IPC, Depth Method, or JIS Standard Test. These three convenient testing methods for tackiness allows you to determine component drop time to loss of adhesion, and thus avoiding costly rework. Tackiness refers to combined force of the cohesion and adhesion. In many cases, chip parts are held on the board by the paste's tackiness during reflow. It is at this time that defects occur from chips falling off the board; or being displaced by the vibration of the chip mounter after some time has elapsed, since printing or when tackiness is reduced by reflow heat.Documents
No documents
MALCOM
TK-1
Verified
CATEGORY
Electronic Test
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
59369
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
MALCOM
TK-1
CATEGORY
Electronic Test
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
59369
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Tackiness TesterConfiguration
No ConfigurationOEM Model Description
The Malcom TK-1 Tackiness Tester is widely used to help predict solder paste tack time, limiting the potential for dropped components, using either the IPC, Depth Method, or JIS Standard Test. These three convenient testing methods for tackiness allows you to determine component drop time to loss of adhesion, and thus avoiding costly rework. Tackiness refers to combined force of the cohesion and adhesion. In many cases, chip parts are held on the board by the paste's tackiness during reflow. It is at this time that defects occur from chips falling off the board; or being displaced by the vibration of the chip mounter after some time has elapsed, since printing or when tackiness is reduced by reflow heat.Documents
No documents