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DPL
Category
Electro PlatingOverview
For next generation silicon solar cells where the SiNx layer has been opened by laser ablation the Meco Direct Plating Line (DPL) can plate a dense layer of Ni-Ag, Ni-Cu-Ag or Ni-Cu-Sn onto high-ohmic emitters. This results in an efficiency increase up to 1% (abs.) and a tremendous cost reduction (US$/Wp) as no Ag paste is needed anymore for the frontside metallization.
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