Description

ECD (Electro Chemical Deposition)

Configuration

Lam / Novellus SABRE Extreme (SABRE I12 ELECTROPLATER, 300mm, i12 Frame) Fixloader - N2 Loadport Control PC’s - 2 proteus PC’s, Chase & main FFU - SABRE FFU and SABRE ANL FFU - Pentagon Front End Robot - Vortex Back End Robot - Vortex Anneal Chambers: 5 Chambers gas box hot plate/cold plate, carrier arm (Fork Carrier) Aligner Station - Optical Aligner- Vortex Transfer Station Plating Cell - Sabre Extreme plating cell Anode chamber - High-Acid anode chamber Charge plate Membrane - High-Acid membrane HRVA - Domed HRVA (non cu); HRVA (cu) Insert - Insert is in cell, mounted above HRVA Clamshell - Modular clamshell drive Cone Cylinder - Dry cylinder Cup - Cup assembly (1.5mm) Lift Controller - IAI Lift controller AAE - AAE assy’s - Cel1, Cell 2/3 Robot Motor Controller Bearings PEM: - Front side treatment: - O-ring style PEM chuck EBR arm nozzle - PEM controllers PEM motor spindles Dosing system: - Dosing system hardware and controls; Dosing control - Dosing system PNL NOWPAK Dosing system kit CDM Module: - CDM module, Syringe controllers. Flow switches & Valves; Chem Dilution Mod Assy - CDM module plumbing kit CDM sensor kit Bath Module: - PS Reservoir Assy Ultrasonic Level Sensor - PVDF Heat Exchanger/ Dual PVDF Heat Exchangers for newer tools or upgrades Plating Pumps: - Plating pump - Flow meters - Vortex Invertor (50Hz) - Frequency invertor used where applicable Aspirator Pump - Selectable Drain Aspirator Heater/ Chiller - TF10000 ESIOCs: - ESIOC’s; - Wafer Handler Bath - Plating Post-plating - Anneal SAC EC2 Controllers: - 1x System controller - 2x Module controllers E -Net - 2 E-net hubs and cabling setup PDA - Plating distribution assembly AE PPS - Dual channel power supply: E-Wave II Additional high configuration details, below are included: i12 configuration Extreme cells Lifts (X-SEL) and tilts (ROBO Cyl) IPA spin controllers PEM's are the same as EPN except for the deflector shields are for Non-Cu style CDM tanks but not used, due to the PRIZE (FST) configuration PSD4 syringe pumps Extreme plating cells Vortex wet and dry robot AE E-WAVE PS EC2 controllers Anneals, but not used for Non-Cu DI/filter compartment is similar to the FX, but w/out SAC O2 Facilities panel is similar to the FX DI booster pump AC 10 cell pump controllers similar to EPN Levitronix SAC pump similar to FX Anneal shroud similar to FX Front end (mini environment) folding side door access to anneals and FE robot, similar to FX

OEM Model Description

The SABRE Extreme, an advanced Electrofill system that has been qualified at 45 nanometers and has demonstrated fill at 32 nanometers. The SABRE Extreme incorporates a number of technological innovations for advanced manufacturing applications, including advanced wafer entry control for thin seed layers (< 200A), tunable profile control for improved uniformities, and the capability to plate on non-copper seed materials.