Description
Plator Off Status: PROD Deminsion (cm): 630x197x275 Weight kg: 3,000.00 2F Rigging (Yes or No): YesConfiguration
No ConfigurationOEM Model Description
The SABRE 3D electroplating system is a highly flexible and modular architecture that can perform a wide range of high-productivity wafer-level packaging (WLP) processes. These include copper through-silicon vias (TSV), copper redistribution layers (RDL), pillars, under-bump metallization, and lead-free micro-bumping. It is specifically designed for the advanced WLP market. The Sabre 3D can produce wafers up to 12 inches in size and has a TSV ECP of 12 inches . The system incorporates many of the technologies used in the SABRE platform, such as sealed dry contacts, innovative clamshell and cell design, SmartDose bath control, and precision wafer handling.Documents
No documents
Verified
CATEGORY
Electro Plating
Last Verified: 3 days ago
Key Item Details
Condition:
Used
Operational Status:
Installed / Running
Product ID:
136171
Wafer Sizes:
8"/200mm
Vintage:
2015
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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LAM RESEARCH / NOVELLUS
SABRE 3D
CATEGORY
Electro Plating
Last Verified: 3 days ago
Key Item Details
Condition:
Used
Operational Status:
Installed / Running
Product ID:
136171
Wafer Sizes:
8"/200mm
Vintage:
2015
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Plator Off Status: PROD Deminsion (cm): 630x197x275 Weight kg: 3,000.00 2F Rigging (Yes or No): YesConfiguration
No ConfigurationOEM Model Description
The SABRE 3D electroplating system is a highly flexible and modular architecture that can perform a wide range of high-productivity wafer-level packaging (WLP) processes. These include copper through-silicon vias (TSV), copper redistribution layers (RDL), pillars, under-bump metallization, and lead-free micro-bumping. It is specifically designed for the advanced WLP market. The Sabre 3D can produce wafers up to 12 inches in size and has a TSV ECP of 12 inches . The system incorporates many of the technologies used in the SABRE platform, such as sealed dry contacts, innovative clamshell and cell design, SmartDose bath control, and precision wafer handling.Documents
No documents