Description
ECD (Electro Chemical Deposition)Configuration
No ConfigurationOEM Model Description
The Raider™ ECD is a fourth-generation single wafer electrochemical deposition tool that delivers advanced metal processing in a small footprint. It is an automated, multi-process tool that is available with cluster modules for metrology, plating, and cleaning. The Raider™ incorporates programmable reactors and can provide an ECD seed layer, a full solution for copper fill with uniformity and film characteristics, and integrated removal of all backside, bevel, and edge copper contamination and seed layer edge exclusion etch. Additionally, in-situ anneal is available. This tool is designed to provide advanced metal processing capabilities in a compact and efficient package.Documents
No documents
APPLIED MATERIALS (AMAT) / SEMITOOL
RAIDER ECD
Verified
CATEGORY
Electro Plating
Last Verified: 22 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
109171
Wafer Sizes:
12"/300mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
View All
APPLIED MATERIALS (AMAT) / SEMITOOL
RAIDER ECD
CATEGORY
Electro Plating
Last Verified: 22 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
109171
Wafer Sizes:
12"/300mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
ECD (Electro Chemical Deposition)Configuration
No ConfigurationOEM Model Description
The Raider™ ECD is a fourth-generation single wafer electrochemical deposition tool that delivers advanced metal processing in a small footprint. It is an automated, multi-process tool that is available with cluster modules for metrology, plating, and cleaning. The Raider™ incorporates programmable reactors and can provide an ECD seed layer, a full solution for copper fill with uniformity and film characteristics, and integrated removal of all backside, bevel, and edge copper contamination and seed layer edge exclusion etch. Additionally, in-situ anneal is available. This tool is designed to provide advanced metal processing capabilities in a compact and efficient package.Documents
No documents