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APPLIED MATERIALS (AMAT) ENDURA ELECTRA Cu
    Description
    CU PLATING
    Configuration
    CU PLATING
    OEM Model Description
    The Endura Electra Cu™ System is a production-proven solution for copper interconnect metallization. It utilizes IMP-based technologies in a revolutionary process sequence to deposit a barrier layer of tantalum (Ta) or tantalum nitride (TaN), followed by a thin seed layer of copper in an IMP Cu chamber. This provides the critical base needed for successful subsequent bulk copper fill. The Endura Electra Cu system is currently being used by industry leaders and is the first-production capable system of its kind.
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    APPLIED MATERIALS (AMAT)

    ENDURA ELECTRA Cu

    verified-listing-icon

    Verified

    CATEGORY

    PVD / Sputtering
    Last Verified: Over 60 days ago
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    56163


    Wafer Sizes:

    12"/300mm


    Vintage:

    2000

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    APPLIED MATERIALS (AMAT) ENDURA ELECTRA Cu
    APPLIED MATERIALS (AMAT)ENDURA ELECTRA CuPVD / Sputtering
    Vintage: 2000Condition: Used
    Last VerifiedOver 60 days ago

    APPLIED MATERIALS (AMAT)

    ENDURA ELECTRA Cu

    verified-listing-icon

    Verified

    CATEGORY

    PVD / Sputtering
    Last Verified: Over 60 days ago
    listing-photo-2570f42d3af34a268626b51059f61877-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    56163


    Wafer Sizes:

    12"/300mm


    Vintage:

    2000


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    CU PLATING
    Configuration
    CU PLATING
    OEM Model Description
    The Endura Electra Cu™ System is a production-proven solution for copper interconnect metallization. It utilizes IMP-based technologies in a revolutionary process sequence to deposit a barrier layer of tantalum (Ta) or tantalum nitride (TaN), followed by a thin seed layer of copper in an IMP Cu chamber. This provides the critical base needed for successful subsequent bulk copper fill. The Endura Electra Cu system is currently being used by industry leaders and is the first-production capable system of its kind.
    Documents

    No documents

    Similar Listings
    View All
    APPLIED MATERIALS (AMAT) ENDURA ELECTRA Cu
    APPLIED MATERIALS (AMAT)
    ENDURA ELECTRA Cu
    PVD / SputteringVintage: 2000Condition: UsedLast Verified: Over 60 days ago
    APPLIED MATERIALS (AMAT) ENDURA ELECTRA Cu
    APPLIED MATERIALS (AMAT)
    ENDURA ELECTRA Cu
    PVD / SputteringVintage: 2000Condition: UsedLast Verified: Over 60 days ago
    APPLIED MATERIALS (AMAT) ENDURA ELECTRA Cu
    APPLIED MATERIALS (AMAT)
    ENDURA ELECTRA Cu
    PVD / SputteringVintage: 2000Condition: UsedLast Verified: Over 60 days ago