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ULVAC ENVIRO
    Description
    power 1, pump 3 Ashing
    Configuration
    CDA/N2/P-O2
    OEM Model Description
    The ENVIRO™ Advanced Dry Strip System is a single wafer load-locked MESC compatible cluster tool designed to strip photoresist and etch sidewall polymers (veils) using precise optical end-point detection, downstream microwave, and non-damage RIE modes. It is excellent for eliminating wet solvent/acid stripper and can be used for post-high dose implant photo-resist stripping, post-metal etch photoresist stripping, post-via/contact etch photoresist stripping, and post-poly/polycide etch photoresist stripping. The dual chamber configuration can be operated in high throughput or independent parallel processing mode, and the control system features Windows™ based software, off-line recipe editing, SECS/GEM communication, and extensive data logging. It is an advanced dry strip system from Phoenix that offers a range of features and applications.
    Documents

    No documents

    verified-listing-icon

    Verified

    CATEGORY
    Dry / Plasma Etch

    Last Verified: Over 60 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    133697


    Wafer Sizes:

    6"/150mm


    Vintage:

    2007


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    ULVAC ENVIRO

    ULVAC

    ENVIRO

    Dry / Plasma Etch
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago

    ULVAC

    ENVIRO

    verified-listing-icon
    Verified
    CATEGORY
    Dry / Plasma Etch
    Last Verified: Over 60 days ago
    listing-photo-c9e615b11c6c46f6934ac4f3ac918727-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    133697


    Wafer Sizes:

    6"/150mm


    Vintage:

    2007


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    power 1, pump 3 Ashing
    Configuration
    CDA/N2/P-O2
    OEM Model Description
    The ENVIRO™ Advanced Dry Strip System is a single wafer load-locked MESC compatible cluster tool designed to strip photoresist and etch sidewall polymers (veils) using precise optical end-point detection, downstream microwave, and non-damage RIE modes. It is excellent for eliminating wet solvent/acid stripper and can be used for post-high dose implant photo-resist stripping, post-metal etch photoresist stripping, post-via/contact etch photoresist stripping, and post-poly/polycide etch photoresist stripping. The dual chamber configuration can be operated in high throughput or independent parallel processing mode, and the control system features Windows™ based software, off-line recipe editing, SECS/GEM communication, and extensive data logging. It is an advanced dry strip system from Phoenix that offers a range of features and applications.
    Documents

    No documents

    Similar Listings
    View All
    ULVAC ENVIRO

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    Dry / Plasma EtchVintage: 0Condition: UsedLast Verified:Over 60 days ago
    ULVAC ENVIRO

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    Dry / Plasma EtchVintage: 0Condition: UsedLast Verified:Over 30 days ago
    ULVAC ENVIRO

    ULVAC

    ENVIRO

    Dry / Plasma EtchVintage: 0Condition: UsedLast Verified:Over 30 days ago