Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The ENVIRO™ Advanced Dry Strip System is a single wafer load-locked MESC compatible cluster tool designed to strip photoresist and etch sidewall polymers (veils) using precise optical end-point detection, downstream microwave, and non-damage RIE modes. It is excellent for eliminating wet solvent/acid stripper and can be used for post-high dose implant photo-resist stripping, post-metal etch photoresist stripping, post-via/contact etch photoresist stripping, and post-poly/polycide etch photoresist stripping. The dual chamber configuration can be operated in high throughput or independent parallel processing mode, and the control system features Windows™ based software, off-line recipe editing, SECS/GEM communication, and extensive data logging. It is an advanced dry strip system from Phoenix that offers a range of features and applications.Documents
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ULVAC
ENVIRO
Verified
CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
46768
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ULVAC
ENVIRO
CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
46768
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The ENVIRO™ Advanced Dry Strip System is a single wafer load-locked MESC compatible cluster tool designed to strip photoresist and etch sidewall polymers (veils) using precise optical end-point detection, downstream microwave, and non-damage RIE modes. It is excellent for eliminating wet solvent/acid stripper and can be used for post-high dose implant photo-resist stripping, post-metal etch photoresist stripping, post-via/contact etch photoresist stripping, and post-poly/polycide etch photoresist stripping. The dual chamber configuration can be operated in high throughput or independent parallel processing mode, and the control system features Windows™ based software, off-line recipe editing, SECS/GEM communication, and extensive data logging. It is an advanced dry strip system from Phoenix that offers a range of features and applications.Documents
No documents