Overview

The UNITY® IIe is a platform designed to achieve excellent cost performance for the 130nm design rule and future technology generations. It is one of the various platforms of the UNITY®, which also includes the M and Me platforms, each designed to achieve higher productivity and reliability for specific applications. The UNITY® IIe delivers world-class process results on a wide range of plasma etch applications, including HARC, Dual Damascene, low-k dielectrics, poly gate, and shallow trench etch. It features PE (IIe), IEM (IIe), DRM and SCCM chambers, and is available in 84, 85 and 88 models. The UNITY® IIe boasts high throughput, a compact design, lower CoO, and ease of maintenance.