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6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
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6" Fab For Sale from Moov - Click Here to Learn More
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TEGAL 903E
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The Tegal 903e is an inline RIE/plasma production etcher configured for six-inch wafers. It is a single-wafer, cassette-to-cassette driven tool with easy-to-use menu control and a 13.56 MHz RF Generator. The input gases are controlled by MFC, with up to 4 MFCs in the system. This tool implements multi-step etch recipes using multiple process gases and has been optimized for specific etches of specific films. Gases available in this configuration are N2, O2, SF6, CHF3, and He. The Tegal 903e plasma dry etch equipment is used by the semiconductor industry for integrated circuit fabrication. It is an industry standard in single-wafer dry etch of silicon nitride, polysilicon, amorphous silicon, and silicon oxide. Wafers are transported to a reaction chamber utilizing a non-friction spatula wafer transport mechanism. A gas mixture is introduced into the Reaction Chamber and becomes reactive by the application of radio frequency (RF) electromagnetic radiation. The reactive mixture, or plasma, etches away material that is not covered by the masking photoresist. The etch process is terminated by time (a parameter specified in the recipe), the wafer is unloaded from the reaction chamber, and a new wafer is introduced repeating the cycle until all wafers have been processed.
    Documents

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    TEGAL

    903E

    verified-listing-icon

    Verified

    CATEGORY
    Dry / Plasma Etch

    Last Verified: Over 60 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    79303


    Wafer Sizes:

    5"/125mm


    Vintage:

    2001


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    TEGAL 903E

    TEGAL

    903E

    Dry / Plasma Etch
    Vintage: 0Condition: Used
    Last Verified3 days ago

    TEGAL

    903E

    verified-listing-icon
    Verified
    CATEGORY
    Dry / Plasma Etch
    Last Verified: Over 60 days ago
    listing-photo-80cbfa318f954f37ad2e4d998940a834-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    79303


    Wafer Sizes:

    5"/125mm


    Vintage:

    2001


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The Tegal 903e is an inline RIE/plasma production etcher configured for six-inch wafers. It is a single-wafer, cassette-to-cassette driven tool with easy-to-use menu control and a 13.56 MHz RF Generator. The input gases are controlled by MFC, with up to 4 MFCs in the system. This tool implements multi-step etch recipes using multiple process gases and has been optimized for specific etches of specific films. Gases available in this configuration are N2, O2, SF6, CHF3, and He. The Tegal 903e plasma dry etch equipment is used by the semiconductor industry for integrated circuit fabrication. It is an industry standard in single-wafer dry etch of silicon nitride, polysilicon, amorphous silicon, and silicon oxide. Wafers are transported to a reaction chamber utilizing a non-friction spatula wafer transport mechanism. A gas mixture is introduced into the Reaction Chamber and becomes reactive by the application of radio frequency (RF) electromagnetic radiation. The reactive mixture, or plasma, etches away material that is not covered by the masking photoresist. The etch process is terminated by time (a parameter specified in the recipe), the wafer is unloaded from the reaction chamber, and a new wafer is introduced repeating the cycle until all wafers have been processed.
    Documents

    No documents

    Similar Listings
    View All
    TEGAL 903E

    TEGAL

    903E

    Dry / Plasma EtchVintage: 0Condition: UsedLast Verified:3 days ago
    TEGAL 903E

    TEGAL

    903E

    Dry / Plasma EtchVintage: 0Condition: UsedLast Verified:3 days ago
    TEGAL 903E

    TEGAL

    903E

    Dry / Plasma EtchVintage: 0Condition: UsedLast Verified:12 days ago