Description
Surface Tech Sys (STS) STS Multiplex DRIE Tool (Bosch Process) Description: Loaklock, single wafer process, manual load/unload. Typical Application: ICP，DRIE Gases: N2, CH4, H2, O2, Ar, SF6, CL2, N2, SiCl4, N2 Chuck: ESC type Wafer Size: 4 inch . Capable upgrade for up to 6 inch or 8 inchConfiguration
No ConfigurationOEM Model Description
None ProvidedDocuments
No documents
Verified
CATEGORY
Dry / Plasma Etch
Last Verified: 18 days ago
Key Item Details
Condition:
Refurbished
Operational Status:
Unknown
Product ID:
138682
Wafer Sizes:
Unknown
Vintage:
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
STS
ASE ICP DRIE
CATEGORY
Dry / Plasma Etch
Last Verified: 18 days ago
Key Item Details
Condition:
Refurbished
Operational Status:
Unknown
Product ID:
138682
Wafer Sizes:
Unknown
Vintage:
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Surface Tech Sys (STS) STS Multiplex DRIE Tool (Bosch Process) Description: Loaklock, single wafer process, manual load/unload. Typical Application: ICP，DRIE Gases: N2, CH4, H2, O2, Ar, SF6, CL2, N2, SiCl4, N2 Chuck: ESC type Wafer Size: 4 inch . Capable upgrade for up to 6 inch or 8 inchConfiguration
No ConfigurationOEM Model Description
None ProvidedDocuments
No documents