Description
Details Attached Load lock, PC-controlled RIE process chamber, power distribution cabinet, RF trolley, remote gas box, and chillerConfiguration
RIE • Load Lock System: Wafer size from 3 inch to 8 inch (75mm to 200mm) capable; Wafer set size = 6 inch (150mm); requires Leybold Ecodry L rotary pump or equivalent (not included). • RIE Process Module: MESC RIE SC100M process chamber; version 1.0; PC controlled; Intellimetrics end-point detector (EPD); Electrode temperature control (+5 to +40 deg C); non-clamped electrode; ENI ACG3B 300/30 watt (13.56MHz) RF supply & matching unit; Remote gasbox; requires Leybold Dryvac 50S dry pump or equivalent (not included) • Electrode Cooling: Huber Unistat 140 chiller • Gasbox: Remote R/H (standard-inc 2x PFC1 module); Gasses: (1) O2, (2) Ar, (3) CF4, (4) SF6.OEM Model Description
STS Multiplex is a type of etcher that offers a large range of materials etching possibility such as insulators (SiO2, Si3N4 and SiC), silicon, metals (Al Alloys, Pt, Ti) and some polymers. It is dedicated for etching metals (processes under chlorine chemistry), quartz (fluorine/carbonate chemistry) and polyimide (oxygen chemistry). STS offers a range of different platform options, each compatible with all STS process technologies. The Multiplex has a single process chamber with manually loaded vacuum loadlock and carousel wafer handler for 2-4 wafers.Documents
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STS
MULTIPLEX
CATEGORY
Dry / Plasma Etch
Last Verified: 3 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
147087
Wafer Sizes:
8"/200mm
Vintage:
2001
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available