Description

Chuck: E-chuck STS Main Etch chamber(72” L x 24” W x 48” H): ASE Type of loadlock:Single Wafer Loadlock RF Power Chart(32” L x 24” W x 40” H): ENI ACG-3 and ENI ACG-10B Low electrode Chiller ( 32” L x 24” W x 32” H): Neslab CFT-75 Pumps and pumping lines: leybold Turbo Pump Chamber Backing Pump:N/A Loadlock Pump:N/A Computer and monitor STS remote gas cabinet (32” L x 13” W x 60” H), Air cannister (12” L x 12” W x 24” H) & accessories. 5 gas lines with 4 of MFCs including Cl2

Configuration

No Configuration

OEM Model Description

The STS MULTIPLEX ICP is an etch system. The STS MULTIPLEX ICP can be used with 2” wafer sizes. It has a silicon material plate and ASE polymer system processer.

Documents

No documents

STS

MULTIPLEX ICP

Verified

Dry / Plasma Etch

Last Verified: 7 days ago

Key Item Details

Condition:

Refurbished

Operational Status:

Unknown

Product ID:

138672

Wafer Sizes:

Unknown

Vintage:

Unknown

Logistics Support

Available

Transaction Insured by Moov

Available

Refurbishment Services

Available

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listing-photo-da2be21fe24d4637a8cdf5fe1d3c9921-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/2186/da2be21fe24d4637a8cdf5fe1d3c9921/f6c798387d8c467cbd684848f8d01ff1_screenshot20260107160559_mw.png

Key Item Details

Condition:

Refurbished

Operational Status:

Unknown

Product ID:

138672

Wafer Sizes:

Unknown

Vintage:

Unknown

Logistics Support

Available

Transaction Insured by Moov

Available

Refurbishment Services

Available

Description

Configuration

No Configuration

OEM Model Description

The STS MULTIPLEX ICP is an etch system. The STS MULTIPLEX ICP can be used with 2” wafer sizes. It has a silicon material plate and ASE polymer system processer.