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Description
No descriptionConfiguration
Model = MESC Multiplex ICP ASE Type = ICP RIE (Inductively Coupled Plasma, Reactive Ion Etch) Description of Process = ASE (Advanced Silicon Etch, Bosch Process) Wafer Size = 150mm Loader capacity = 2 wafer Carousel Chuck Type = Mechanical Weighted Clamp Process Gases: C4F8 = 300 Sccms SFG = 600 Sccms O2 = 100 Sccms AR = 100 Sccms Turbo Pump = Leybold Mag 2000 CT RF Generator 1 = ENI ACG-3 RF Generator 2 = AE RFG 3001 (Advanced Energy) Vacuum measurement = MKS Instruments Gate Valve = VAT Throttling Gate Valve Slit Valve = Vat Slit Valve Manuals = STS MESC Multiplex ICP Operator’s and Modular Parts Catalogue Vacuum Pump Loadlock = Edwards Pump E2M40 Vacuum Pump Process Module = Edwards IQDP80 w/IQDB250 Blower (intelligent Interface) Chiller = Affinity, PWG-060K-BE33CBC2OEM Model Description
The STS MULTIPLEX ICP is an etch system. The STS MULTIPLEX ICP can be used with 2” wafer sizes. It has a silicon material plate and ASE polymer system processer.Documents
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PREFERRED
SELLER
Verified
CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
Buyer pays 12% premium of final sale price
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
64816
Wafer Sizes:
6"/150mm
Vintage:
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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PREFERRED
SELLER
STS
MULTIPLEX ICP
CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
Buyer pays 12% premium of final sale price
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
64816
Wafer Sizes:
6"/150mm
Vintage:
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Model = MESC Multiplex ICP ASE Type = ICP RIE (Inductively Coupled Plasma, Reactive Ion Etch) Description of Process = ASE (Advanced Silicon Etch, Bosch Process) Wafer Size = 150mm Loader capacity = 2 wafer Carousel Chuck Type = Mechanical Weighted Clamp Process Gases: C4F8 = 300 Sccms SFG = 600 Sccms O2 = 100 Sccms AR = 100 Sccms Turbo Pump = Leybold Mag 2000 CT RF Generator 1 = ENI ACG-3 RF Generator 2 = AE RFG 3001 (Advanced Energy) Vacuum measurement = MKS Instruments Gate Valve = VAT Throttling Gate Valve Slit Valve = Vat Slit Valve Manuals = STS MESC Multiplex ICP Operator’s and Modular Parts Catalogue Vacuum Pump Loadlock = Edwards Pump E2M40 Vacuum Pump Process Module = Edwards IQDP80 w/IQDB250 Blower (intelligent Interface) Chiller = Affinity, PWG-060K-BE33CBC2OEM Model Description
The STS MULTIPLEX ICP is an etch system. The STS MULTIPLEX ICP can be used with 2” wafer sizes. It has a silicon material plate and ASE polymer system processer.Documents
No documents