Description
STS Deep Reactive Ion Si Etcher (Bosch Process) The STS Multiplex DRIE system uses the Bosch process to etch silicon deeply and anisotropic. In addition to the platen RF power supply used for reactive ion etching (RIE), the system is equipped with an inductively coupled plasma (ICP) RF source, which allows independent control of plasma density and DC bias. The system features a water-cooled electrode and helium backside cooling to maintain the sample at a low temperature during processing. It is designed to accommodate and etch 200 mm wafers.Configuration
No ConfigurationOEM Model Description
The STS MULTIPLEX ICP is an etch system. The STS MULTIPLEX ICP can be used with 2” wafer sizes. It has a silicon material plate and ASE polymer system processer.Documents
No documents
Verified
CATEGORY
Dry / Plasma Etch
Last Verified: 3 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
64816
Wafer Sizes:
8"/200mm
Vintage:
1997
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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STS
MULTIPLEX ICP
CATEGORY
Dry / Plasma Etch
Last Verified: 3 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
64816
Wafer Sizes:
8"/200mm
Vintage:
1997
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
STS Deep Reactive Ion Si Etcher (Bosch Process) The STS Multiplex DRIE system uses the Bosch process to etch silicon deeply and anisotropic. In addition to the platen RF power supply used for reactive ion etching (RIE), the system is equipped with an inductively coupled plasma (ICP) RF source, which allows independent control of plasma density and DC bias. The system features a water-cooled electrode and helium backside cooling to maintain the sample at a low temperature during processing. It is designed to accommodate and etch 200 mm wafers.Configuration
No ConfigurationOEM Model Description
The STS MULTIPLEX ICP is an etch system. The STS MULTIPLEX ICP can be used with 2” wafer sizes. It has a silicon material plate and ASE polymer system processer.Documents
No documents