Description

No description

Configuration

Omega fxP Etch System This System will be built to standard specifications according to the configuration below: • fxP Transport Module • One Dsi-v Process module • One ICP Process module • One Isopod Process module • System configured for 200mm wafers • 4-color Alarm Tower • Extended 20m metre Electrical lines (free cable length) • Power distribution cabinet • UPS (uninterrupted power supply) • Ancillaries cabinet • Through wall or ballroom installation kit • Bracket-mounted monitor and keyboard • Maintenance laptop for rear control • Standard setup tool kit fxP Transport Module • 8-port transport module • Brooks dual pan robot • Two vacuum cassette elevators (VCE’s) • Wafer alignment & centraliser as required for process • SMIF interface kit (Seller to supply 2 x Fortrend SMIF pods) DSi-v Process Module • Bosch process deep Si module • Source RF generator • Bias RF generator • Bias variable matching unit • Source solid state matching unit • Heated VAT pendulum valve • Extracted gas box containing 6 digital MFCs (2 additional MFCs available) • Temperature managed Maglev turbo pump • Chamber capacitance manometer (1.0 torr) • Optical endpoint system • Wafer Edge Protection (WEP) kit • Electro-static chuck, PSU & He back-pressure control • Heated lower chamber & upper chamber • Foreline heating • Chamber shielding as required for process Options: • Two additional gas lines ICP Process Module • Low pressure, high density plasma • Source RF generator • Bias RF generator • Bias variable matching unit • Source variable matching unit • Heated VAT pendulum valve • Electro-static chuck, PSU & He back-pressure control • Heated lower chamber & lid • Optical endpoint system • Extracted gas box containing 6 digital MFCs (2 additional MFCs available) • Temperature managed Maglev turbo pump • Chamber capacitance manometers (0.1 and 1.0 torr) • Foreline heating if required by process • Chamber shielding as required for process 1 Options: • Two additional gas lines Isopod Process Module • High pressure, downstream plasma • Source RF generator • Source solid state matching unit • Wafer heating using hot paddle, ambient to 300°C • Extracted surface mount gas box containing 4 digital MFCs • Chamber capacitance manometer (10 torr)

OEM Model Description

Omega fxP is a cluster system supporting up to 6 plasma etch (ICP, DRIE, and/or Synapse) chambers. The fxP is an 8-sided cluster system supporting up to 6 process modules for the ultimate in throughput, availability and productivity.