
Description
No descriptionConfiguration
200mm max size (etch area is 100mm via quartz clamp) Physical etch assist via Ar Chemical etch via F or Cl Modification of etching environment toward reducing (H2) or oxidizing (O2) Cryo stage for deep RIE etching (Bosch)OEM Model Description
Etching SystemDocuments
No documents
Verified
CATEGORY
Dry / Plasma Etch
Last Verified: 13 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
138636
Wafer Sizes:
Unknown
Vintage:
2012
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
OXFORD
100 180 ICP
CATEGORY
Dry / Plasma Etch
Last Verified: 13 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
138636
Wafer Sizes:
Unknown
Vintage:
2012
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
200mm max size (etch area is 100mm via quartz clamp) Physical etch assist via Ar Chemical etch via F or Cl Modification of etching environment toward reducing (H2) or oxidizing (O2) Cryo stage for deep RIE etching (Bosch)OEM Model Description
Etching SystemDocuments
No documents