Description
Dry etch systemConfiguration
Known issues: Not included: Turbo Controller; (Qty 2) Generator; Vat Motor Open Cassette Factory Interface (Qty 2) Harmonic Handler Stand Alone Main System Process: Poly etch Software Version: Classic CIM: SECS, GEMOEM Model Description
The TCP 9400SE is a high density, low pressure etch system from Lam’s TCP product line. It incorporates the Company’s patented Transformer Coupled Plasma source technology for etching 0.35 micron and smaller geometries. The TCP 9400SE is used for polysilicon and polycide etch applications. It operates at lower pressures for improved pattern transfer control and higher plasma density for higher etch rates with independent power control to the lower electrode, which improves etch results across a wider process window. Lam’s TCP systems are designed to offer customers a reliable, lower cost of ownership solution to their advanced needs. The TCP systems are available as stand-alone, single wafer tools, or on the Alliance multichamber cluster platform.Documents
No documents
CATEGORY
Dry / Plasma Etch
Last Verified: 5 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
154793
Wafer Sizes:
8"/200mm
Vintage:
1998
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH CORPORATION
TCP 9400SE
CATEGORY
Dry / Plasma Etch
Last Verified: 5 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
154793
Wafer Sizes:
8"/200mm
Vintage:
1998
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Dry etch systemConfiguration
Known issues: Not included: Turbo Controller; (Qty 2) Generator; Vat Motor Open Cassette Factory Interface (Qty 2) Harmonic Handler Stand Alone Main System Process: Poly etch Software Version: Classic CIM: SECS, GEMOEM Model Description
The TCP 9400SE is a high density, low pressure etch system from Lam’s TCP product line. It incorporates the Company’s patented Transformer Coupled Plasma source technology for etching 0.35 micron and smaller geometries. The TCP 9400SE is used for polysilicon and polycide etch applications. It operates at lower pressures for improved pattern transfer control and higher plasma density for higher etch rates with independent power control to the lower electrode, which improves etch results across a wider process window. Lam’s TCP systems are designed to offer customers a reliable, lower cost of ownership solution to their advanced needs. The TCP systems are available as stand-alone, single wafer tools, or on the Alliance multichamber cluster platform.Documents
No documents