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Description
Rainbow 4428Configuration
No ConfigurationOEM Model Description
Rainbow 4400 is part of the Rainbow series of etch systems introduced in 1987. It addresses processes for wafer sizes up to 200mm and feature sizes as small as 0.35 micron. The Rainbow 4400 is designed for etching polysilicon films and incorporates unique features such as a patented wafer handling system, a proprietary source for generating stable plasma, and an overall product design that has received industry awards for quality and reliability. These features enable semiconductor manufacturers to reduce wafer particle contamination, improve etch selectivity and uniformity while maintaining profile control and process flexibility.Documents
No documents
CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
105886
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH CORPORATION
RAINBOW 4400
CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
105886
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Rainbow 4428Configuration
No ConfigurationOEM Model Description
Rainbow 4400 is part of the Rainbow series of etch systems introduced in 1987. It addresses processes for wafer sizes up to 200mm and feature sizes as small as 0.35 micron. The Rainbow 4400 is designed for etching polysilicon films and incorporates unique features such as a patented wafer handling system, a proprietary source for generating stable plasma, and an overall product design that has received industry awards for quality and reliability. These features enable semiconductor manufacturers to reduce wafer particle contamination, improve etch selectivity and uniformity while maintaining profile control and process flexibility.Documents
No documents