Description
ETCHConfiguration
4C/HOEM Model Description
The 2300 Exelan is a dielectric etch system introduced in November 2000, designed to process both 200mm and 300mm wafers. It combines Dual Frequency Confined™ (DFC™) plasma technology with state-of-the-art chamber design to provide advanced process performance for copper conductive lines creation, latest generation insulating films, and high aspect ratio applications. It features the industry’s largest dielectric etch portfolio and is capable of meeting the challenges of new materials and reduced geometries at the 130nm technology node and below.Documents
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LAM RESEARCH CORPORATION
2300 EXELAN
Verified
CATEGORY
Dry / Plasma Etch
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
112406
Wafer Sizes:
12"/300mm
Vintage:
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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LAM RESEARCH CORPORATION
2300 EXELAN
CATEGORY
Dry / Plasma Etch
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
112406
Wafer Sizes:
12"/300mm
Vintage:
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
ETCHConfiguration
4C/HOEM Model Description
The 2300 Exelan is a dielectric etch system introduced in November 2000, designed to process both 200mm and 300mm wafers. It combines Dual Frequency Confined™ (DFC™) plasma technology with state-of-the-art chamber design to provide advanced process performance for copper conductive lines creation, latest generation insulating films, and high aspect ratio applications. It features the industry’s largest dielectric etch portfolio and is capable of meeting the challenges of new materials and reduced geometries at the 130nm technology node and below.Documents
No documents