Description
Metal dry etching machineConfiguration
No ConfigurationOEM Model Description
The TCP 9600SE is a high density, low pressure etch system from Lam’s TCP product line. It incorporates the Company’s patented Transformer Coupled Plasma source technology for etching 0.35 micron and smaller geometries. It is used for metal etch applications and is designed to offer customers a reliable, lower cost of ownership solution to their advanced needs. The system operates at lower pressures for improved pattern transfer control and higher plasma density for higher etch rates. It is available as a stand-alone, single wafer tool, or on the Alliance multichamber cluster platform.Documents
No documents
LAM RESEARCH CORPORATION
TCP 9600SE
Verified
CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
115063
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH CORPORATION
TCP 9600SE
CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
115063
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Metal dry etching machineConfiguration
No ConfigurationOEM Model Description
The TCP 9600SE is a high density, low pressure etch system from Lam’s TCP product line. It incorporates the Company’s patented Transformer Coupled Plasma source technology for etching 0.35 micron and smaller geometries. It is used for metal etch applications and is designed to offer customers a reliable, lower cost of ownership solution to their advanced needs. The system operates at lower pressures for improved pattern transfer control and higher plasma density for higher etch rates. It is available as a stand-alone, single wafer tool, or on the Alliance multichamber cluster platform.Documents
No documents