Description
No descriptionConfiguration
Wafer EtchingOEM Model Description
2300 Syndion C is a product in the Syndion etch product family that provides the layer-by-layer process flexibility and control needed for cost-efficient via etch for TSV applications. It offers high process flexibility, superior profile control, and excellent uniformity to address multiple TSV etch applications. It also has a low cost of ownership due to high etch rates, excellent repeatability, and in-situ etching of multiple materials in the TSV stack. Both conventional single-step etch and rapidly alternating process (RAP) are supported. Key applications include TSV for CMOS 3D IC and TSV for image sensors.Documents
No documents
CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
129944
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH CORPORATION
2300 SYNDION-C
CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
129944
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Wafer EtchingOEM Model Description
2300 Syndion C is a product in the Syndion etch product family that provides the layer-by-layer process flexibility and control needed for cost-efficient via etch for TSV applications. It offers high process flexibility, superior profile control, and excellent uniformity to address multiple TSV etch applications. It also has a low cost of ownership due to high etch rates, excellent repeatability, and in-situ etching of multiple materials in the TSV stack. Both conventional single-step etch and rapidly alternating process (RAP) are supported. Key applications include TSV for CMOS 3D IC and TSV for image sensors.Documents
No documents