Description
ETCHConfiguration
No ConfigurationOEM Model Description
M-8170XT Sebit is the upgraded version of the M-8170 that was launched in 2007. In addition to the microwave ECR approach, the new model introduces high-speed wafer temperature control, high vacuum exhaust control technology, and a symmetrical chamber structure. The new system achieves superior profile controllability, CD uniformity, and edge exclusion performance for hard mask etching and double patterning-compatible mask etching. The system also handles high-k dielectric gate insulation film, metal gates and a variety of other new materials. Major semiconductor memory manufacturers have already completed their evaluation for the 20nm generation of the system, and are looking to incorporate it into their mass production lines going forward.Documents
No documents
HITACHI
M-8170XT
CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
131551
Wafer Sizes:
12"/300mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
ETCHConfiguration
No ConfigurationOEM Model Description
M-8170XT Sebit is the upgraded version of the M-8170 that was launched in 2007. In addition to the microwave ECR approach, the new model introduces high-speed wafer temperature control, high vacuum exhaust control technology, and a symmetrical chamber structure. The new system achieves superior profile controllability, CD uniformity, and edge exclusion performance for hard mask etching and double patterning-compatible mask etching. The system also handles high-k dielectric gate insulation film, metal gates and a variety of other new materials. Major semiconductor memory manufacturers have already completed their evaluation for the 20nm generation of the system, and are looking to incorporate it into their mass production lines going forward.Documents
No documents