Description
Details Attached Hitachi High-Technologies HS 9050 Dry Etch / Plasma AsherConfiguration
configured for high-current operation (150A, 3Ø AC 208V). This 12” multi-chamber platform comprises: Five Asher / Etch chambers Two Cooling chambers Integrated transfer modules Mini-Environment Wafer Loading Module (EFEM) The system is configured for copper processing. Engineered for precision processing, optimizing etching and ashing capabilities in semiconductor applications.OEM Model Description
HS-9050 is equipped with a gas system compatible with both organic and inorganic films. Processing can be flexibly set based on the structure of the film layers, enabling the entire removal process of multilayer resists in next-generation devices to be performed within the same chamber. Meanwhile, helical downflow plasma has been newly adopted as the plasma source, resulting in a highly efficient, less damaging process.Documents
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HITACHI
HS-9050
CATEGORY
Dry / Plasma Etch
Last Verified: Today
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
143410
Wafer Sizes:
12"/300mm
Vintage:
2019
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available