Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The wide process window of the AeroSonic dryer offers the possibility of tailored recipes for various substrate materials such as Si, SiO2, quartz and GaAs, regardless of hydrophilic or hydrophobic surfaces. There is no limitation in wafer size - it is applicable to all wafer diameters used today. It’s even possible to dry different wafers or substrates sizes simultaneously within one process bath.Documents
No documents
AP&S
AeroSonic
Verified
CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
78693
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
AP&S
AeroSonic
CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
78693
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The wide process window of the AeroSonic dryer offers the possibility of tailored recipes for various substrate materials such as Si, SiO2, quartz and GaAs, regardless of hydrophilic or hydrophobic surfaces. There is no limitation in wafer size - it is applicable to all wafer diameters used today. It’s even possible to dry different wafers or substrates sizes simultaneously within one process bath.Documents
No documents