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AeroSonic
Category
Dry / Plasma EtchOverview
The wide process window of the AeroSonic dryer offers the possibility of tailored recipes for various substrate materials such as Si, SiO2, quartz and GaAs, regardless of hydrophilic or hydrophobic surfaces. There is no limitation in wafer size - it is applicable to all wafer diameters used today. It’s even possible to dry different wafers or substrates sizes simultaneously within one process bath.
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