Description
ETCHConfiguration
3C/HOEM Model Description
Two new etch systems were launched in 1996 for HDP etching of metal and silicon films, using AMAT's DPS (Decoupled Plasma Source) technology. The DPS Metal Etch Centura and DPS Silicon Etch Centura are aimed at very advanced applications, primarily for deep submicron devices (0.25-micron).Documents
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APPLIED MATERIALS (AMAT)
CENTURA METAL DPS
Verified
CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
75711
Wafer Sizes:
12"/300mm
Vintage:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT)
CENTURA METAL DPS
CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
75711
Wafer Sizes:
12"/300mm
Vintage:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
ETCHConfiguration
3C/HOEM Model Description
Two new etch systems were launched in 1996 for HDP etching of metal and silicon films, using AMAT's DPS (Decoupled Plasma Source) technology. The DPS Metal Etch Centura and DPS Silicon Etch Centura are aimed at very advanced applications, primarily for deep submicron devices (0.25-micron).Documents
No documents