Description
Plasma DRIE Etch Equipment, Deep Silicon Etch, EndPoint, Mag 7Configuration
Tool Configuration: - Brooks Platform - Dual Loadlocks - Magnatron 7 - Alcatel ACT 600M TMP Turbo - User Interface PC - Transfer PC Process Chamber: AMS X200 - Alcatel ACT 1300M TMP Turbo Process Gases: - SF6 1000sccm - C4F8 400sccm - O2 100sccm - O2 800sccm - Ar 200sccm - N2 1000sccm - Ar - CHF3 EDM - CS200-11729 - 200/208VAC, 3 Phase, 50/60Hz Alcatel AMS X200 - CE Marked - Qty 2 - SEMCO HV52000C - SEREN L301 RF - Advanced Energy Dressler Cesar RF - ENI Spectrum B-3013 RF - 208VAC, 3 Phase, 50/60HzOEM Model Description
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PFEIFFER / ALCATEL / ADIXEN
AMS 4200
Verified
CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
31911
Wafer Sizes:
Unknown
Vintage:
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PFEIFFER / ALCATEL / ADIXEN
AMS 4200
CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
31911
Wafer Sizes:
Unknown
Vintage:
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Plasma DRIE Etch Equipment, Deep Silicon Etch, EndPoint, Mag 7Configuration
Tool Configuration: - Brooks Platform - Dual Loadlocks - Magnatron 7 - Alcatel ACT 600M TMP Turbo - User Interface PC - Transfer PC Process Chamber: AMS X200 - Alcatel ACT 1300M TMP Turbo Process Gases: - SF6 1000sccm - C4F8 400sccm - O2 100sccm - O2 800sccm - Ar 200sccm - N2 1000sccm - Ar - CHF3 EDM - CS200-11729 - 200/208VAC, 3 Phase, 50/60Hz Alcatel AMS X200 - CE Marked - Qty 2 - SEMCO HV52000C - SEREN L301 RF - Advanced Energy Dressler Cesar RF - ENI Spectrum B-3013 RF - 208VAC, 3 Phase, 50/60HzOEM Model Description
None ProvidedDocuments
No documents