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AP&S AeroSonic
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The wide process window of the AeroSonic dryer offers the possibility of tailored recipes for various substrate materials such as Si, SiO2, quartz and GaAs, regardless of hydrophilic or hydrophobic surfaces. There is no limitation in wafer size - it is applicable to all wafer diameters used today. It’s even possible to dry different wafers or substrates sizes simultaneously within one process bath.
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    AP&S

    AeroSonic

    verified-listing-icon

    Verified

    CATEGORY
    Dry Etch

    Last Verified: Over 60 days ago

    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    78693

    Wafer Sizes:

    Unknown

    Vintage:

    Unknown

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    AP&S AeroSonic

    AP&S

    AeroSonic

    Dry Etch
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago

    AP&S

    AeroSonic

    verified-listing-icon
    Verified
    CATEGORY
    Dry Etch
    Last Verified: Over 60 days ago
    listing-photo-0bda765479d747e0b7f978c0e6ab1d41-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1148/0bda765479d747e0b7f978c0e6ab1d41/a4e93c75caf545339e39965b24ef698e_0b110f4ac6c84310a2903967f4aa0abe1201a_mw.jpeg
    listing-photo-0bda765479d747e0b7f978c0e6ab1d41-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1148/0bda765479d747e0b7f978c0e6ab1d41/83e5e4ab22d14717952621eac5ecdb03_fb9de1dc2db54064b0e3cd8a9d6522181201a_mw.jpeg
    listing-photo-0bda765479d747e0b7f978c0e6ab1d41-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1148/0bda765479d747e0b7f978c0e6ab1d41/3043cb6462bd46e99175c39ae851cf5f_e474bac93a3745ec9afd0f7c5788c35a1201a_mw.jpeg
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    78693

    Wafer Sizes:

    Unknown

    Vintage:

    Unknown

    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The wide process window of the AeroSonic dryer offers the possibility of tailored recipes for various substrate materials such as Si, SiO2, quartz and GaAs, regardless of hydrophilic or hydrophobic surfaces. There is no limitation in wafer size - it is applicable to all wafer diameters used today. It’s even possible to dry different wafers or substrates sizes simultaneously within one process bath.
    Documents

    No documents

    Similar Listings
    View All
    AP&S AeroSonic

    AP&S

    AeroSonic

    Dry EtchVintage: 0Condition: UsedLast Verified: Over 60 days ago