Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The Datacon DS9000e is a high speed fully automatic die sorter with output to a frame or carrier. It handles any wafer sizes up to 300 mm and can therefore reconstruct wafers to different output form factors. This enables the transition to larger wafer formats without having to reinvest in downstream packaging equipment. Besides wafers, the DS9000e handle a variety of chip carriers such as waffle pack, JEDEC tray, and Gel-Pak.Documents
No documents
BESI / DATACON
DS9000e
Verified
CATEGORY
Die Sorters & Attachers
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
82122
Wafer Sizes:
12"/300mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / DATACON
DS9000e
CATEGORY
Die Sorters & Attachers
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
82122
Wafer Sizes:
12"/300mm
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The Datacon DS9000e is a high speed fully automatic die sorter with output to a frame or carrier. It handles any wafer sizes up to 300 mm and can therefore reconstruct wafers to different output form factors. This enables the transition to larger wafer formats without having to reinvest in downstream packaging equipment. Besides wafers, the DS9000e handle a variety of chip carriers such as waffle pack, JEDEC tray, and Gel-Pak.Documents
No documents